High Advance Sendirian Berhad
| Business category 1 | Other Electronic Components |
| City ( of main office ) | Perai, MY, Malaysia |
| Address | 9, Lorong Nagasari 25, Taman Nagasari |
| Phones | 60-12-4216368 |
| Fax | 60-04-3998018 |
| Web site | www.highadvance.com |
| About | We take this opportunity to introduce to your esteemed organisation the following Rework Services provided by us which we hope may be useful to you: - 1. Bga & MICRO BGA RE-BALLING - RE-BALLING ACCORDING TO FLIP CHIP PACKAGES IPC STANDARDS. 2. Pcba REWORK & REMODIFICATION - REWORK ON LIFTED PADS, BROKEN TRACE, EYELETS, EDGE DAMAGED, REMOVAL & ATTACHMENT OF BGA & ETC. 3. IC LEAD RECONDITIONING - SEMI-AUTO MACHINE TO REWORK IC BEND LEADS TO PERFECT COPLANARITY. 4. Bga TESTER SOCKET - FABRICATION OF BGA TESTER SOCKET. 5. Component REWORK - PREPPING - OXIDISATION TREATMENT - TIN / GOLD PLATING 6. Screening AND SORTING 7. PCB DESIGN, FABRICATION & ASSEMBLY 8. In HOUSE REWORK FOR A FRACTION OF THE COST, WE ARE ABLE TO BRING LIFE TO VARIOUS TYPES OF SCRAPPED BGA & PCBA. Please do channel all the enquiries that you have to us , we'll be more than happy to assist you. Looking forward to serving you better. |
| Date | 2011 Oct 29, 11:10 |